{"id":151,"date":"2020-01-03T11:57:56","date_gmt":"2020-01-03T10:57:56","guid":{"rendered":"http:\/\/labs.dimes.unical.it\/x-lab\/?page_id=151"},"modified":"2025-06-19T13:07:35","modified_gmt":"2025-06-19T11:07:35","slug":"active-projects","status":"publish","type":"page","link":"https:\/\/labs.dimes.unical.it\/maic-lab\/active-projects\/","title":{"rendered":"Active projects"},"content":{"rendered":"\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\"><\/div>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:75%\">\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_82_2 counter-hierarchy ez-toc-counter ez-toc-light-blue ez-toc-container-direction\">\n<label for=\"ez-toc-cssicon-toggle-item-69e10de0f2e1a\" class=\"ez-toc-cssicon-toggle-label\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Toggle<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewBox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewBox=\"0 0 24 24\" version=\"1.2\" baseProfile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/label><input type=\"checkbox\"  id=\"ez-toc-cssicon-toggle-item-69e10de0f2e1a\"  aria-label=\"Toggle\" \/><nav><ul class='ez-toc-list ez-toc-list-level-1 ' ><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/labs.dimes.unical.it\/maic-lab\/active-projects\/#%E2%94%9C_SHIFT\" >\u251c SHIFT<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/labs.dimes.unical.it\/maic-lab\/active-projects\/#%E2%94%9C_SOIL\" >\u251c SOIL<\/a><\/li><\/ul><\/nav><\/div>\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%94%9C_SHIFT\"><\/span><strong>\u251c SHIFT<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<h5 class=\"wp-block-heading\"><strong>Objective<\/strong><\/h5>\n\n\n\n<p>SHIFT (SHIFT &#8211; Sustainable Technologies Enabling Future Telecom Applications) develops innovative semiconductor and packaging technologies for telecommunication areas such as 5GNR (Beyond 5G) and 6G wireless network access and backhaul, ultra-high speed optical links between servers, satellite telecommunications, and Earth observation. SHIFT makes significant contributions to the &#8220;twin transition&#8221; through innovations for advanced telecommunications<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Develop new Semiconductor and packaging Technologies for the high frequencies of 6G era<\/li>\n\n\n\n<li>Demonstrate the new semiconductor technologies by innovative and competitive System Demonstrators\u200b<\/li>\n\n\n\n<li>Demonstrate their economic and societal effects while reducing current environmental impacts<\/li>\n<\/ul>\n\n\n\n<h5><strong>Related publications<\/strong><\/h5>\n<div class=\"csl-bib-body\">\n<div class=\"csl-entry\">\u00a0<\/div>\n<div class=\"csl-entry\">\n<div class=\"csl-left-margin\">\u00a0<\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:25%\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"859\" src=\"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-content\/uploads\/sites\/9\/2023\/12\/SHIFT-logo-1024x859.jpg\" alt=\"\" class=\"wp-image-460\" srcset=\"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-content\/uploads\/sites\/9\/2023\/12\/SHIFT-logo-1024x859.jpg 1024w, https:\/\/labs.dimes.unical.it\/maic-lab\/wp-content\/uploads\/sites\/9\/2023\/12\/SHIFT-logo-300x252.jpg 300w, https:\/\/labs.dimes.unical.it\/maic-lab\/wp-content\/uploads\/sites\/9\/2023\/12\/SHIFT-logo-768x644.jpg 768w, https:\/\/labs.dimes.unical.it\/maic-lab\/wp-content\/uploads\/sites\/9\/2023\/12\/SHIFT-logo-1536x1288.jpg 1536w, https:\/\/labs.dimes.unical.it\/maic-lab\/wp-content\/uploads\/sites\/9\/2023\/12\/SHIFT-logo.jpg 1601w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n<\/div>\n\n\n<h5 class=\"wp-block-heading\">Partners<\/h5>\n\n\n\n<ul>\n<li>University of Calabria &#8211; MAIC LAB<\/li>\n<li>ST Microelectronics<\/li>\n<li>SIAE Microelettronica, Italy<\/li>\n<li>University of Pavia<\/li>\n<li>University of Roma &#8220;La Sapienza&#8221;<\/li>\n<li>University of L&#8217;Aquila<\/li>\n<li>Politecnico di Milano<\/li>\n<li>University of Roma Tor Vergata<\/li>\n<\/ul>\n\n\n\n<h5 class=\"wp-block-heading\">Funding<\/h5>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"301\" height=\"144\" src=\"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-content\/uploads\/sites\/9\/2025\/06\/EULOGO.png\" alt=\"\" class=\"wp-image-507\" style=\"width:136px;height:auto\"\/><\/figure>\n<\/div>\n\n\n<p class=\"has-text-align-center\">EU-Horizon Europe-KDT JU <\/p>\n\n\n\n<p class=\"has-text-align-center\">2023-2026<\/p>\n\n\n\n<h5>Project website<\/h5>\n<p><a href=\"https:\/\/www.shiftkdt.eu\/\" target=\"_blank\" rel=\"noopener noreferrer\">https:\/\/www.shiftkdt.eu\/<\/a><\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:75%\">\n<h3 class=\"wp-block-heading\"><span class=\"ez-toc-section\" id=\"%E2%94%9C_SOIL\"><\/span><strong>\u251c SOIL<\/strong><span class=\"ez-toc-section-end\"><\/span><\/h3>\n\n\n\n<h5 class=\"wp-block-heading\"><strong>Objective<\/strong><\/h5>\n\n\n\n<p>Solidify the European FDSOI Ecosystem Accelerating its Industrial Deployment<br>(SOIL) The European FDSOI family of technology platforms is recognized for its low power consumption, versatility, high radiation hardness, embedded non-volatile memories and exceptional radio frequency capabilities. The objective of the SOIL project is to extend FDSOI technology platforms and broaden their use within the European industry in order to provide Europe with a real alternative to semiconductor supply autonomy using FDSOI semiconductors. We will thus expand a European technology manufactured by European players and suited to the European and Worldwide market. The SOIL project will give Europe the opportunity to move forward with industrial and academic players spanning the value chain by joining in the risk-taking necessary for the growth dynamics of semiconductors for Automotive, Space, IOT and Edge AI domain in Europe. The SOIL project will accelerate the implementation of semiconductor manufacturing based on FDSOI technology, building, and securing the European semiconductor value chain from material to system, supporting the twin green and digital transition. SOIL will expand the family of European FDSOI technology platforms by developing production and innovation capabilities in the following key areas: i) Advanced features: prepare next generation of FDSOI technologies and components; ii) Semiconductor Intellectual Property (SIP) core: reinforce the FDSOI design ecosystem and the supply chain around FDSOI manufacturing; iii) Digital, analog &amp; RF single-chip integration capabilities (Microcontroller Unit; RF communication; RF sensor, e.g. radar). The project will shape the future by developing new technology approaches as well as numerous IPs on advanced applications and will promote the capability and benefits of the technology by providing advanced demonstrations on key applications and comparing the technology. SOIL will strengthen and expand the overall FDSOI ecosystem from material to system.<\/p>\n\n\n\n<h5><strong>Related publications<\/strong><\/h5>\n<div class=\"csl-bib-body\">\n<div class=\"csl-entry\">\u00a0<\/div>\n<div class=\"csl-entry\">\n<div class=\"csl-left-margin\">\u00a0<\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\"><\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:25%\"><div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"164\" height=\"63\" src=\"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-content\/uploads\/sites\/9\/2025\/06\/soil-1.png\" alt=\"\" class=\"wp-image-509\" style=\"width:208px;height:auto\"\/><\/figure>\n<\/div>\n\n\n<h5 class=\"wp-block-heading\">Partners<\/h5>\n\n\n\n<ul>\n<li>University of Calabria &#8211; MAIC LAB<\/li>\n<li>ST Microelectronics<\/li>\n<li>SIAE Microelettronica, Italy<\/li>\n<\/ul>\n\n\n\n<h5 class=\"wp-block-heading\">Funding<\/h5>\n\n\n\n<p class=\"has-text-align-center\">EU-Horizon Europe<\/p>\n\n\n\n<p class=\"has-text-align-center\">2024-2027<\/p>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter is-resized\"><img loading=\"lazy\" decoding=\"async\" width=\"301\" height=\"144\" src=\"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-content\/uploads\/sites\/9\/2025\/06\/EULOGO.png\" alt=\"\" class=\"wp-image-507\" style=\"width:141px;height:auto\"\/><\/figure>\n<\/div>\n\n\n<h5>Project website<\/h5>\n<p><\/p>\n<p><a href=\"https:\/\/cordis.europa.eu\/project\/id\/101139785\">https:\/\/cordis.europa.eu\/project\/id\/101139785<\/a><\/p>\n<p>\u00a0<\/p>\n<\/div>\n<\/div>\n<\/div><\/div>\n\n\n\n<div class=\"wp-block-group\"><div class=\"wp-block-group__inner-container is-layout-flow wp-block-group-is-layout-flow\">\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9d6595d7 wp-block-columns-is-layout-flex\"><\/div>\n<\/div><\/div>\n","protected":false},"excerpt":{"rendered":"<p>\u251c SHIFT Objective SHIFT (SHIFT &#8211; Sustainable Technologies Enabling Future Telecom Applications) develops innovative semiconductor and packaging technologies for telecommunication areas such as 5GNR (Beyond 5G) and 6G wireless network access and backhaul, ultra-high speed optical links between servers, satellite telecommunications, and Earth observation. SHIFT makes significant contributions to the &#8220;twin transition&#8221; through innovations for [&hellip;]<\/p>\n","protected":false},"author":17,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-151","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-json\/wp\/v2\/pages\/151","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-json\/wp\/v2\/users\/17"}],"replies":[{"embeddable":true,"href":"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-json\/wp\/v2\/comments?post=151"}],"version-history":[{"count":18,"href":"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-json\/wp\/v2\/pages\/151\/revisions"}],"predecessor-version":[{"id":515,"href":"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-json\/wp\/v2\/pages\/151\/revisions\/515"}],"wp:attachment":[{"href":"https:\/\/labs.dimes.unical.it\/maic-lab\/wp-json\/wp\/v2\/media?parent=151"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}