├Multi-channel core chips for K-Ka SatCom phased arrays
![](https://labs.dimes.unical.it/maic-lab/wp-content/uploads/sites/9/2021/05/FLEXWIN-chip-1.jpg)
Micrograph of an hexa-core K-Ka SatCom integrated circuits (3.3 x 3.5 mm²) in a 0.25 μm SiGe:C BiCMOS process provided by IHP GmbH
In strong collaboration with the University of Ulm, we’ve developed multi-channel chips for Rx/Tx K/Ka band SatCom applications.
Main publications
[1] F. Tabarani, L. Boccia, T. Purtova, A. Shamsafar, H. Schumacher, e G. Amendola, «0.25-um SiGe BiCMOS System-on-Chip for K-/Ka-Band Satellite Communication Transmit–Receive Active Phased Arrays», IEEE Transactions on Microwave Theory and Techniques, vol. 66, n. 5, pagg. 2325–2339, mag. 2018, doi: 10.1109/TMTT.2017.2774804.
[2] F. Tabarani, L. Boccia, D. Calzona, G. Amendola, e H. Schumacher, «Power-efficient full-duplex K/Ka-band phased array front-end», IET Microwaves, Antennas & Propagation, vol. 14, n. 4, pagg. 268–280, 2019.